SK Hynix said on the 27th that the company will participate in CES 2023, which will be held in Las Vegas, USA from January 5th to 8th next year, to showcase its main memory products and new product lineup.
SK hynix emphasized: “At this CES, the company synchronized with the SK Group’s ‘carbon-free future’ direction, and decided to display products that will significantly reduce carbon emissions under the theme of ‘green digital solutions’. The products that the company will disclose The lineup not only reduces environmental impact, but also offers significant improvements in performance and efficiency over the previous generation, and we look forward to attracting a lot of attention from technology customers and experts around the world.”
Recently, with the acceleration of the growth of cutting-edge technology industries such as AI, big data, unmanned driving, and metaverse, global technology companies are paying attention to memory semiconductors that can quickly process rapidly increasing data and improve energy consumption efficiency. SK Hynix believes that the products to be exhibited at CES have the high power-per-watt* and performance that meet customers’ needs.
* Efficiency to power consumption ratio: the data capacity index that can be processed per second per certain unit of power
The core product displayed by the company this time is the ultra-high-performance enterprise-level SSD product PS1010 E3.S (hereinafter referred to as PS1010). PS1010 is a module product combining multiple SK hynix 176-layer 4D NAND, which supports PCIe fifth generation (Gen 5)* standard.
* PCIe (Peripheral Component Interconnect Express): High-speed input/output interface of serial structure on the motherboard of electronic products. It is characterized by approximately doubling of the data transfer rate with each rising generation.
The technical team of SK hynix explained, “The memory market for servers continues to grow despite the slump, and in this situation, the company showcased new products that bring together the most competitive technologies.” In fact, the PS1010 has the same The reading and writing speeds have increased by up to 130% and 49% respectively. In addition, the product has an improved power consumption ratio of more than 75%, which is expected to reduce customers’ server operating expenses and carbon emissions.
Yoon Jae-ran, vice president of SK hynix (in charge of NAND product planning), said, “I am very proud to introduce SSD products that can solve the pain points of server customers at the world’s largest exhibition. I look forward to products equipped with self-developed controllers and firmware. Based on this, the company’s NAND business competitiveness has been further strengthened.”
At the same time, SK Hynix will showcase a new generation of memory products suitable for high-performance computing (HPC, High Performance Computing), the existing highest performance DRAM “HBM3*”, PIM* technology that uses memory to add computing functions “GDDR6-AiM”, “CXL* memory” that flexibly expands memory capacity and performance, etc.
* HBM (High Bandwidth Memory): A high-value-added, high-performance product that connects multiple DRAMs vertically and significantly improves data processing speed compared to existing DRAMs
* PIM (Processing-In-Memory): Adding computing functions to memory semiconductors, a new generation technology that can solve the problem of data transmission stagnation in the fields of artificial intelligence (AI) and big data processing
* CXL (Compute Express Link): In order to effectively build a high-performance computing system, a new generation of Interconnect Protocol based on PCIe
In addition, SK hynix’s CES booth will also showcase the immersion cooling (Immersion Cooling)* technology of SK enmove, an energy efficiency subsidiary of SK Group. This technology can lower the start-up temperature of semiconductor servers, and SK hynix plans to expand cooperation with group members and external partners in the future, aiming to create new added value in the entire semiconductor business.
* Liquid immersion cooling (Immersion Cooling): A new generation of thermal management technology that directly immerses the data server in cooling oil for cooling. Compared with the existing air-cooled type, the cooling power is greatly reduced, and the overall power consumption can be reduced by about 30%.
